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High Density Dip solder 180°

  • Boardlock
  • With machined contacts
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Number Of Poles

  • 15
  • 26
  • 44
  • 62
  • 78
Article Number BL4HDT 15 52 G. BL4HT 15 62 G.
Number Of Contacts 15 15
Upper Temperature +125 °C +125 °C
Lower Temperature -55 °C -55 °C
Contact Plating Mating area: Au over Ni Termination area: Sn over Ni Mating area: Au over Ni Termination area: Sn over Ni
Housing Material St. tinned St. tinned
Contact Material Cu alloy Cu alloy
Remark* For the requested quality class please replace the "." at the end of the article no. By using 1,2,3 For the requested quality class please replace the "." at the end of the article no. By using 1,2,3
Insulation Resistance ≥10 MΩ ≥10 MΩ
Extra Information Mounting lug distance spacer and threaded rivet in one part The connector is snapped into the circuit board in one operation, is exactly spaced and is fixed by an UNC 4-40 thread Available as board lock without bolt Mounting lug distance spacer and threaded rivet in one part The connector is snapped into the circuit board in one operation, is exactly spaced and is fixed by an UNC 4-40 thread Available as board lock without bolt
Contact Resistance ≤10m ≤10m
Gender Male Female
Insulator Material PBT GF UL 94-V0 PBT GF UL 94-V0
Mating/unmating Force Fully Loaded Connector ≤50 ≤50
Air And Creepage Distance min. 0,6 mm min. 0,6 mm
Test Voltage U Eff 1000 1000
Working Voltage 60 60
Current Rating At 20°c 3 3
Quality Class* Class 1 = 500 mating cycles Class 2 = 200 mating cycles Class 3 = 50 mating cycles Class 1 = 500 mating cycles Class 2 = 200 mating cycles Class 3 = 50 mating cycles
Les propriétés diffèrent selon les variantes et sous-variantes